Federal Awards · EV GROUP INC · Award

WAFER BONDING SYSTEM TO INCLUDE ONE BONDING ALIGNMENT SYSTEM, SHIPPING, INSTALLATION AND TRAINING.

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID
1333ND18PNB680291
Contractor
EV GROUP INC
Awarding agency
Department of Commerce
Sub-agency / office
National Institute of Standards and Technology
Award amount
$888,526
Period of performance
Aug 21, 2018 – Feb 1, 2019
NAICS
333242 — Semiconductor Machinery Manufacturing

Public award description

WAFER BONDING SYSTEM TO INCLUDE ONE BONDING ALIGNMENT SYSTEM, SHIPPING, INSTALLATION AND TRAINING.

Source: USAspending.gov

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