Federal Awards · Award

AUTOMATED WIRE-BONDER FOR PACKAGING HIGH TEMPERATURE SIC INTEGRATED CIRCUITS

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID
80GRC022P0004
Contractor
Sub-agency / office
National Aeronautics and Space Administration
Award amount
$254,591
Period of performance
Dec 29, 2021 – Jun 29, 2022
NAICS
333242 — Semiconductor Machinery Manufacturing
PSC
PSC 5961
Place of performance
OH

Public award description

Limited purpose

AUTOMATED WIRE-BONDER FOR PACKAGING HIGH TEMPERATURE SIC INTEGRATED CIRCUITS

Source: USAspending.gov

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