AUTOMATED WIRE-BONDER FOR PACKAGING HIGH TEMPERATURE SIC INTEGRATED CIRCUITS
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80GRC022P0004
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $254,591
- Period of performance
- Dec 29, 2021 – Jun 29, 2022
- NAICS
- 333242 — Semiconductor Machinery Manufacturing
- PSC
- PSC 5961
- Place of performance
- OH
Public award description
AUTOMATED WIRE-BONDER FOR PACKAGING HIGH TEMPERATURE SIC INTEGRATED CIRCUITS
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