SEMICONDUCTOR WAFER BONDING SYSTEM
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80GSFC23CA054
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $553,600
- Period of performance
- Jun 5, 2023 – Oct 4, 2024
- NAICS
- 333242 — Semiconductor Machinery Manufacturing
- PSC
- PSC 3670
- Place of performance
- AZ
Public award description
SEMICONDUCTOR WAFER BONDING SYSTEM
Find out who's winning similar federal contracts
Discover comparable awards, related contractors, and agency purchasing history.