IN THIS SBIR PROJECT, WE WILL DEVELOP A PASSIVE THERMAL MANAGEMENT SYSTEM FOR MICROELECTRONICS THAT ARE INT…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80NSSC18P2180
- Contractor
- ARIECA INC.
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $125,000
- Period of performance
- Jul 27, 2018 – Jan 25, 2019
- NAICS
- 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- PSC
- PSC AR11
Public award description
IN THIS SBIR PROJECT, WE WILL DEVELOP A PASSIVE THERMAL MANAGEMENT SYSTEM FOR MICROELECTRONICS THAT ARE INTEGRATED INTO SPACE SUITS, GLOVES, AND OTHER SOFT GOODS. THE SYSTEM WILL BE COMPOSED OF A THERMALLY CONDUCTIVE RUBBER THAT IS MOLDED AROUND THE HEAT-PRODUCING COMPONENTS. IN ORDER TO ENABLE MECHANICAL DEFORMATION, THE MICROELECTRONIC COMPONENTS WILL BE WIRED TOGETHER WITH SOFT AND STRETCHABLE CIRCUITRY. IN GENERAL, THE CIRCUIT WIRING CAN BE ANY SOFT CONDUCTOR THAT MAINTAINS LOW ELECTRICAL RESISTIVITY WHEN STRETCHED. FOR THE PURPOSES OF THIS PROJECT, WE WILL USE WIRING COMPOSED OF A NON-TOXIC, BIOCOMPATIBLE EUTECTIC ALLOY OF GALLIUM AND INDIUM.
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