Federal Awards · MULTILAYER PROTOTYPES INCORPORATED · Award

SMCU INTERFACE BOARDS REVISION 3, MAIN PCB P/N OF-DSI-BRD-1242.2-2020-R02 IB-V3 3 EACH AND MEZZANINE OF-DSI…

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: 80NSSC18P2701
Contractor: MULTILAYER PROTOTYPES INCORPORATED
Awarding agency: National Aeronautics and Space Administration
Sub-agency / office: National Aeronautics and Space Administration
Award amount: $22,999
Period of performance: Aug 2, 2018 – Oct 3, 2018
NAICS: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC: PSC 5962

Public award description

SMCU INTERFACE BOARDS REVISION 3, MAIN PCB P/N OF-DSI-BRD-1242.2-2020-R02 IB-V3 3 EACH AND MEZZANINE OF-DSI-BRD-1242.2-2021-R02 IB-V3 3 EACH, WITH SHIPPING

Source: USAspending.gov

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