VORAGO TECHNOLOGIES HAS PRODUCED AN IC DEFINITION AND ARCHITECTURE FOR A RAD-HARD I/O EXPANSION CHIP THAT I…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80NSSC19C0182
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $747,761
- Period of performance
- Aug 11, 2019 – Jul 10, 2020
- NAICS
- 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- PSC
- PSC AR11
- Place of performance
- TX
Public award description
VORAGO TECHNOLOGIES HAS PRODUCED AN IC DEFINITION AND ARCHITECTURE FOR A RAD-HARD I/O EXPANSION CHIP THAT IS CAPABLE OF INTERFACING TO NEXT GENERATION SPACEFLIGHT PROCESSOR DEVICES INCLUDING THE HIGH-PERFORMANCE SPACEFLIGHT COMPUTING (HPSC) CHIPLET. WE HAVE GATHERED THE BEST AVAILABLE KNOWLEDGE OF HPSC USE-CASES TO CONCEPTUALIZE AND ARTICULATE THE REQUIREMENTS FOR AN I/O EXPANSION CHIP, CREATING AN ARCHITECTURE FOR AN OPTIMIZED AND ROBUST IC THAT CAN BE IMPLEMENTED TO MEET THE REQUIREMENTS OF NEXT.GENERATION NASA SPACE ELECTRONICS SYSTEMS.
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