STTR PHASE 1 FIBER-TO-CHIP FUSION SPLICING FOR LOW-LOSS PHOTONIC PACKAGING WITH SPACE APPLICATIONS

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: 80NSSC23PB533
Contractor
Awarding agency: National Aeronautics and Space Administration
Sub-agency / office: National Aeronautics and Space Administration
Award amount: $149,987
Period of performance: Aug 3, 2023 – Sep 2, 2024
NAICS: 541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
PSC: PSC AJ14
Place of performance: NY

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