Federal Awards · Award

MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID
80NSSC24PC199
Contractor
Sub-agency / office
National Aeronautics and Space Administration
Award amount
$65,500
Period of performance
Aug 26, 2024 – Sep 30, 2025
NAICS
334419 — Other Electronic Component Manufacturing
PSC
PSC H299
Place of performance
WA

Public award description

Limited purpose

MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS

Source: USAspending.gov

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