MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- 80NSSC24PC199
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $65,500
- Period of performance
- Aug 26, 2024 – Sep 30, 2025
- NAICS
- 334419 — Other Electronic Component Manufacturing
- PSC
- PSC H299
- Place of performance
- WA
Public award description
MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS
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