PHOTONIC INTEGRATED CIRCUIT PACKAGING SERVICE FOR 8 PICS. INCLUDES WORE BONDING TO PCB, FIBER ALIGNMENT AND…

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: 80NSSC26P1297
Contractor
Awarding agency: National Aeronautics and Space Administration
Sub-agency / office: National Aeronautics and Space Administration
Award amount: $59,485
Period of performance: Aug 14, 2026 – Oct 9, 2026
NAICS: 813920 — Professional Organizations
PSC: PSC R609
Place of performance: CA

Public award description

PHOTONIC INTEGRATED CIRCUIT PACKAGING SERVICE FOR 8 PICS. INCLUDES WORE BONDING TO PCB, FIBER ALIGNMENT AND BONDING OF FAUS AND ASSOCIATED PROCESS DEVELOPMENT AND ENGINEERING COSTS.

Source: USAspending.gov

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