Federal Awards · QORVO TEXAS, LLC · Award

EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIE…

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Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID
FA238524CB004
Contractor
QORVO TEXAS, LLC
Awarding agency
Department of Defense
Sub-agency / office
Department of the Air Force
Award amount
$14,328,165
Period of performance
Nov 17, 2023 – Jun 18, 2027
NAICS
541715 — Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Place of performance
RICHARDSON, TX, 750801324, USA
Competition
FULL AND OPEN COMPETITION · Set-aside: NO SET ASIDE USED. · 6 offers
Pricing
COST PLUS FIXED FEE
Financial breakdown
Current value $11,890,531 · Obligated $10,982,433 · Potential value $11,890,531 · Latest action obligation $1,250,000

Public award description

EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS)

Most recent · Modification P00010 · Jul 2, 2026 · $1,250,000 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00009 · Jun 24, 2026 · $0 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00008 · Apr 29, 2026 · $2,798,695 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00007 · Sep 10, 2025 · $1,797,037 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00006 · Aug 7, 2025 · $0 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00005 · Apr 24, 2025 · $0 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00004 · Mar 26, 2025 · $0 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00003 · Jun 13, 2024 · $850,061 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification P00002 · Feb 6, 2024 · $0 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN · FA238524CB004

Modification P00001 · Dec 21, 2023 · $2,789,953 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) DARPA PROGRAM: TECHNOLOGIES FOR HEAT REMOVAL IN ELECTRONICS AT THE DEVICE SCALE (THREADS) · FA238524CB004

Modification 0 · Nov 16, 2023 · $1,496,687 action obligation · EXCEPTIONAL THERMAL RESISTANCE ENGINEERING OF MICRO-ELECTRONIC GAN (EXTREME GAN) · FA238524CB004

Source: USAspending.gov

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