MOLDING COMPOUND: A 2-PART, EPOXY PUTTY SYSTEM T HAT IS FILLED WITH STAINLESS STEEL FOR REPAIRING AND REBUI…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNB0X6512
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- May 30, 2012 – Jul 2, 2012
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8030
- Place of performance
- NY
- Parent award
- GS06F83805
Public award description
MOLDING COMPOUND: A 2-PART, EPOXY PUTTY SYSTEM T HAT IS FILLED WITH STAINLESS STEEL FOR REPAIRING AND REBUILDING STAINLESS STEEL EQUIPMENT. SZ: A 1 LB KIT CONSISTING OF BASE EPOXY RESIN AND HAR DENER IN SEPARATE CONTAINERS. SHELF LIFE CODE: 9 (5 YRS) MAX AGE ON DEL: 6 MO ITW-DEVCON INC. PR ODUCT STAINLESS STEEL PUTTY (ST), PN 10270. (PAR TIAL DESCRIPTION)
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