MOLDING COMPOUND: A 2-PART, ALUMINUM-FILLED, POU RABLE LIQUID EPOXY RESIN SYSTEM FOR MAKING MOLDS , PATTERN…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNBCF6209
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- Sep 14, 2009 – Oct 17, 2009
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8030
- Place of performance
- NY
- Parent award
- GS06F83805
Public award description
MOLDING COMPOUND: A 2-PART, ALUMINUM-FILLED, POU RABLE LIQUID EPOXY RESIN SYSTEM FOR MAKING MOLDS , PATTERNS, AND HOLDING FIXTURES. SZ: A 1 LB KIT CONSISTING OF BASE RESIN AND CURING AGENT IN SE PARATE CONTAINERS. SHELF LIFE CODE: 9 (5 YRS) MA X AGE ON DEL: 6 MO ITW-DEVCON INC. PRODUCT ALUMI NUM LIQUID (F-2), PN 10710. (PARTIAL DESCRIPTION )
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