_ PLEASE EXPEDITE. COMPOUND, SILICONE, HEAT SINK: IAW MILSPC MIL-PR F-47009D DATED NOVEMBER 9, 2006, COMPOU…

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: GSMPNBCT3321
Contractor
Awarding agency: General Services Administration
Sub-agency / office: Federal Acquisition Service
Funding agency: Department of Defense
Award amount: $0
Period of performance: Aug 30, 2011 – Oct 2, 2011
NAICS: 325520 — Adhesive Manufacturing
PSC: PSC 8030
Place of performance: MS

Public award description

_ PLEASE EXPEDITE. COMPOUND, SILICONE, HEAT SINK: IAW MILSPC MIL-PR F-47009D DATED NOVEMBER 9, 2006, COMPOUND, SILIC ONE, HEAT SINK. TYPE III: THERMAL CONDUCTIVITY O F 0.0005 G-CAL/SQ CM/DEG. C/SEC/CM. SZ: 8 WT OZ PACKAGED IN JARS SHELF LIFE CODE: 4 (12 MO) MAX AGE ON DEL: 2 MO (PARTIAL DESCRIPTION)

Source: USAspending.gov

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