ADHESIVE: A TWO-PART, GENERAL PURPOSE, THIXOTROP IC, EPOXY ADHESIVE SYSTEM FOR APPLICATIONS REQUI RING GAP…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNBFF2330
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- Jan 12, 2010 – Feb 28, 2010
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8040
- Place of performance
- OH
- Parent award
- GS06FB3004
Public award description
ADHESIVE: A TWO-PART, GENERAL PURPOSE, THIXOTROP IC, EPOXY ADHESIVE SYSTEM FOR APPLICATIONS REQUI RING GAP FILLING OR NON-SLUMPING CHARACTERISTICS ON VERTICAL SURFACES. SZ:A 1/2 PINT KIT CONSIS TING OF BASE EPOXY RESIN AND THE REQUIRED AMOUNT OF HARDENER IN SEPARATE CONTAINERS. SHELF LIFE CODE: 4 (12 MO) MAX AGE ON DEL: 2 MO LORD CORP. PRODUCT 309. (PARTIAL DESCRIPTION)
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