SEALING COMPOUND: A FILLED EPOXY RESIN COMPOUND USED TO SHIM GAPS IN METAL OR COMPOSITE ASSEMBLI ES INCLUDI…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNBPB8682
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- Jan 23, 2012 – Feb 10, 2012
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8030
- Place of performance
- TX
Public award description
SEALING COMPOUND: A FILLED EPOXY RESIN COMPOUND USED TO SHIM GAPS IN METAL OR COMPOSITE ASSEMBLI ES INCLUDING REPAIRS TO AIRCRAFT SKINS. SZ: 50 G RAM FIELD KIT CONSISTING OF BASE EPOXY RESIN AND THE REQUIRED AMOUNT OF HARDENER. STORAGE SHELF LIFE: 7 ( 3 YRS ) MAX AGE ON DEL: 6 MO. DYNAMOLD , INC., PN DMS-4-828-FK50. (PARTIAL DESCRIPTION)
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