ADHESIVE : A ONE COMPONENT, SILVER-PLATED-ALUMIN UM FILLED, ELECTRICALLY CONDUCTIVE, METHOXY CURE , SILICON…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNEY43651
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- Jan 12, 2011 – Feb 14, 2011
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8030
- Place of performance
- NY
- Parent award
- GS06F73226
Public award description
ADHESIVE : A ONE COMPONENT, SILVER-PLATED-ALUMIN UM FILLED, ELECTRICALLY CONDUCTIVE, METHOXY CURE , SILICONE RESIN BASED ADHESIVE/SEALANT FOR BOND ING EMI GASKETS OR AS A CAULK FOR PROVIDING EMI AND ENVIRONMENTAL PROTECTION. SZ: 2.5 OZ IN A FO IL TUBE WITH SEPARATE ENCLOSED CHO-BOND 1086 PRI MER. SHELF LIFE CODE: 4 (12 MO) MAX AGE ON DEL: 2 MO CHOMERICS INC., PRODUCT CHO-BOND 1075, PN 5 0-02-1075-0000. (PARTIAL DESCRIPTION)
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