RESIN, EPOXY, LOW PRESSURE LAMINATING: IAW MILSP C MIL-R-9300B, RESIN, EPOXY, LOW-PRESSURE LAMINA TI
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- GSMPNF8B1387
- Contractor
- Awarding agency
- General Services Administration
- Sub-agency / office
- Federal Acquisition Service
- Funding agency
- Department of Defense
- Award amount
- $0
- Period of performance
- Dec 15, 2006 – Jan 17, 2007
- NAICS
- 325520 — Adhesive Manufacturing
- PSC
- PSC 8030
- Place of performance
- CA
Public award description
RESIN, EPOXY, LOW PRESSURE LAMINATING: IAW MILSP C MIL-R-9300B, RESIN, EPOXY, LOW-PRESSURE LAMINA TI
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