IGF::OT::IGF MC8 PREP PARTS WAVE SOLDER

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: ING13PX00134
Contractor
Awarding agency: Department of the Interior
Sub-agency / office: U.S. Geological Survey
Award amount: $7,425
Period of performance: Jan 8, 2013 – Jan 31, 2013
NAICS: 334418 — Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC: PSC H193
Place of performance: WA

Limited purpose

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