SAP PURCHASE REQUISITION: 4200247421. UHV BEAM EVAPORATION OF ELEMENTAL HALFNIUM. SHALL BE FULLY EQUIVALENT…

Public award description

SAP PURCHASE REQUISITION: 4200247421. UHV BEAM EVAPORATION OF ELEMENTAL HALFNIUM. SHALL BE FULLY EQUIVALENT TO THE SVT-EBSH-4.5-C FROM SVT ASSOCIATES WITH THE FOLLOWING ADDITIONAL REQUIREMENTS: 1. ASSEMBLY SHALL BE COMPLETELY COMPATIBLE WITH EXISTING GOVERNMENT OWNED CREATEC-BRAND-MBE (MELCULAR BEAM EPITAXIAL) SYSTEM OR EQUIVALENT AND MOUNTED ON A STANDARD OD 4.5" CF TYPE UHV (ULTRA HIGH VACUUM) STAINLESS STEEL FLANGE. A. COMPLETE SYSTEM SHALL BE CERTIFIED HELIUM-LEAK TESTED IN ULTRA GIGH VACUUM TO LESS THAN 1E-10 MILLIBAR-LITER PER SECOND. B. SHALL HAVE AN IN-VACUUM LENGTH OF AT LEAST 257 MILLIMETERS AND LESS THAN 260 MILLIMETERS, MEASURED FROM THE CELL FLANGE FACE TO THE FURTHEST PART ON THE CELL. 2. CHALL ACCOMODATE HALFNIUM "SHOT" IN A HEARTH STYLE WITH COMPATIBLE CRUCIBLE TO AACOMODATE AT LEAST 2 CUBIC CENTIMETERS IN VOLUME OF HALFNIUM "SHOT." A. HEARTH SHALL BE ANGLED AS SPECIFIED BY END USER AT TIME OF MANUFACTURE. B. HEARTH-LINER SHALL BE OF COMPATIBLE MATERIAL FOR HALFNIUM, SUCH AS GRAPHITE. 3. SHALL BE CAPABLE OF SOURCE-HEATING WITHIN THE TEMPERATURE RANGE OF 150 DEGREES CELSIUS TO AT LEAST 3000 DEGREES CELSIUS. 4. SHALL INCLUDE WATER COOLING TO THE HEARTH ASSEMBLY USING A MATERIAL EQUAL TO OR GREATER THAN THAT OF A COPPER HEAT SINK ASSEMBLY. 5. SHALL INCLUDE PROVISION TO PURCHASE OPTIONAL CRUCIBLE LINERS FROM OEM. 6. SHALL IMPLEMENT AN APPROXIMATE FULL CIRCLE FILAMENT AROUND THE TOP OF THE HEARTH TO ELIMINATE "HOT SPOTS" ON THE HALFNIUM SHOT. A. WITH THE FILAMENT GUARANTEED TO BE "OUT OF THE LINE-OF-SIGHT" TO EFFECTIVELY PROVIDE MAINTENANCE-FREE CHANGE OF CRUCIBLE-LINERS CONTAINING A SOURCE MATERIAL DIFFERENT THAN HALFNIUM. B. DEPOSITION RATES CONTROLLABLE AND PROVIDE EQUAL TO OR GREATER THAN DEPOSITION RATES OF 0.2 NANOMETERS PER MINUTE AT A TARGET DISTANCE OF 100 MILLIMETERS USING A HALFNIUM SOURCE TEMPERATURE OF APPROXIMATELY 3100 DEGREE CELSIUS. 7. SHALL INCLUDE AN INTEGRATED BEAM FLUX MONITOR WITH: A. INTEGRATED COMMUNICATION INTERFACE. B. FEEDBACK CONTROLLER WITH ALL CABLES. C. HARDWIRED INTERLOCK TO COOLING-WATER FLOW. D. MODIFIED FOR ELECTRON BEAM SOURCE WITH COLLECTION GRID. 8. SHALL INCLUDE ALL CABLES AND A POWER SUPPLY WITH THE FOLLOWING MINIMUM CAPABILITIES: A. ELECTRICAL: MINIMUM OF 3000 WATTS TOTAL POWER OUTPUT. B. POWER CABLES TO SURVIVE TO A MINIMUM TEMPERATURE OF 200 DEGREES CELSIUS. C. CONTROLS: MANUAL CONTROL OF SETTINGS BY USER INCLUDING FRONT PANEL CONTROL OF AT LEAST THE EMISSION CURRENT, HIGH VOLTAGE BIAS AND FILAMENT CURRENT. 9. SHALL INCLUDE CLOSED LOOP CONTROL VIA THE INTEGRATED FLUX MONITOR WITH THE POWER SUPPLY. 10. SHALL INCLUDE INSTALLATION HARDWARE FOR A 19-INCH RACK MOUNTING OF 6U OR LESS. 11. SHALL BE WIRED FOR 220VAC, SINGLE PHASE, 60HZ POWERLINE OPERATION. 12. SHALL INCLUDE ALL INSTALLATION, ON-SITE HALFNIUM-SOURCE DEMONSTRATION/DEPOSITION OF REQUIRED PERFORMANCE, AND TRAINING AND DOCUMENTATION.