IGF::CL::IGF FUNDS FOR MAINTENANCE ON SUSS SB6E SILICON WAFER BOND. TRAVEL EXPENSES INCLUDED.

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID: NNG13LM71P
Contractor
Awarding agency: National Aeronautics and Space Administration
Sub-agency / office: National Aeronautics and Space Administration
Award amount: $0
Period of performance: Aug 20, 2013 – Sep 4, 2013
NAICS: 811310 — Commercial and Industrial Machinery and Equipment (except Automotive and Electronic) Repair and Maintenance
PSC: PSC J099
Place of performance: CA

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