IGF::OT::IGF FUNDS PROVIDED FOR THE DISASSEMBLE, REASSEMBLE AND TESTING OF FOUR (4) ELECTRONICS BOARDS FOR…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- NNG13PR05P
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $0
- Period of performance
- May 14, 2013 – Jun 13, 2013
- NAICS
- 334412 — Bare Printed Circuit Board Manufacturing
- PSC
- PSC K059
- Place of performance
- CA
Public award description
IGF::OT::IGF FUNDS PROVIDED FOR THE DISASSEMBLE, REASSEMBLE AND TESTING OF FOUR (4) ELECTRONICS BOARDS FOR XILINX SIRF RADIATION TEST BOARD FABRICATION.
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