Federal Awards · Award

IGF::OT::IGF FUNDS PROVIDED FOR THE DISASSEMBLE, REASSEMBLE AND TESTING OF FOUR (4) ELECTRONICS BOARDS FOR…

Award details are derived from public USAspending.gov records. Not a bid recommendation.

Award details

Award ID
NNG13PR05P
Contractor
Sub-agency / office
National Aeronautics and Space Administration
Award amount
$0
Period of performance
May 14, 2013 – Jun 13, 2013
NAICS
334412 — Bare Printed Circuit Board Manufacturing
PSC
PSC K059
Place of performance
CA

Public award description

IGF::OT::IGF FUNDS PROVIDED FOR THE DISASSEMBLE, REASSEMBLE AND TESTING OF FOUR (4) ELECTRONICS BOARDS FOR XILINX SIRF RADIATION TEST BOARD FABRICATION.

Source: USAspending.gov

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