THE PROPOSED PROGRAM WILL DEVELOP HIGHLY RELIABLE, HERMETIC, SI3N4 CERAMIC MULTICHIP MODULES TO INTEGRATE C…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- NNX10CE23P
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $0
- Period of performance
- Jan 29, 2010 – Jul 29, 2010
- NAICS
- 541712 — Research and Development in the Physical, Engineering, and Life Sciences
- PSC
- PSC AR11
- Place of performance
- WA
Public award description
THE PROPOSED PROGRAM WILL DEVELOP HIGHLY RELIABLE, HERMETIC, SI3N4 CERAMIC MULTICHIP MODULES TO INTEGRATE COMMERCIALLY AVAILABLE SIC POWER DEVICES TO BUILD POWER ELECTRONIC MODULES FOR RELIABLE OPERATION ABOVE 500A C IN EXTREME ENVIRONMENTS OF SPACE EXPLORATION. THE PHASE I PROGRAM WILL DEMONSTRATE A RELIABLE DIRECT BOND COPPER (DBC) PROCESS FOR SI3N4 SUBSTRATES, DEVELOP HIGH CURRENT CARRYING HERMETIC FEEDTHROUGHS, AN INNOVATIVE TRANSIENT LIQUID PHASE (TLP) DIE ATTACH, AND A MONOMETALLIC WIRE BONDING CAPABLE OF RELIABLE OPERATION ABOVE 500A C; AND FABRICATE AND TEST A HERMETIC SINGLE-CHIP MODULE.
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