PLANETARY EXPLORATION MISSIONS REQUIRE ELECTRONICS PACKAGING THAT CAN WITHSTAND EXTREME TEMPERATURES AND NU…
Award details are derived from public USAspending.gov records. Not a bid recommendation.
Award details
- Award ID
- NNX11CF75P
- Contractor
- Awarding agency
- National Aeronautics and Space Administration
- Sub-agency / office
- National Aeronautics and Space Administration
- Award amount
- $0
- Period of performance
- Jul 26, 2011 – Sep 29, 2011
- NAICS
- 541712 — Research and Development in the Physical, Engineering, and Life Sciences
- PSC
- PSC AR11
- Place of performance
- MA
Public award description
PLANETARY EXPLORATION MISSIONS REQUIRE ELECTRONICS PACKAGING THAT CAN WITHSTAND EXTREME TEMPERATURES AND NUMEROUS TEMPERATURE CYCLES (-230C TO +350C). THE PRESENT PROJECT PROPOSES A NOVEL METALLIZED CERAMIC SUBSTRATES THAT COULD POTENTIALLY WITHSTAND THESE TEMPERATURE EXTREMES AND SERVE AS RELIABLE PACKAGING PLATFORMS. PHASE I RESEARCH WILL BE AIMED AT CONFIRMING THIS - NEW METALLIZED CERAMIC SUBSTRATES WILL BE SUBJECTED TO SEVERE THERMAL CYCLING TESTS AND ANY CHANGE IN METALLIZATION ADHESION TO CERAMIC OR CHANGE IN ELECTRICAL PROPERTIES WILL BE QUANTIFIED. IF PHASE I IS SUCCESSFUL, WE WILL PROCEED TO ADDRESSING THE OTHER IMPORTANT ISSUES, LIKE ETCHING, PLATING, WIRE BONDING AND DIE BONDING TO NEW SUBSTRATES TO RESULT IN A DEMONSTRATOR PACKAGE CAPABLE OF WITHSTANDING THE EXTREME THERMAL CYCLING.
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