SAM.gov listing

Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

National Aeronautics and SPACE Administration → NASA SHARED Services CENTERSpecial NoticeSolicitation 80NSSC26939631Q

Response deadline

Wed, Aug 12, 2026, 4:00 PM EDT

Product Service Code

PSC 6099
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Opportunity details

NAICS
813920
Notice type
Special Notice
Original posted
August 10, 2026
Last updated
August 30, 2026
Notice ID
9517449fa10b4afd8b72b245d5a29ed8

Related Federal Opportunities

Why this matters

  • This notice is a special notice.
  • The listed response deadline is Aug 12, 2026.
  • 1 related opportunity shares this NAICS.

Related federal terms

  • NAICS — North American Industry Classification System
  • PSC — Product Service Code

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