SBIR/STTR Research Award

Tiled Silicon-Photomultiplier Array Read-Out Integrated Circuit

Award identifier 76a46bc11f5d5252c732ed7c94526985a47072455f9e7700924375497deae3a2Awarding agency National Aeronautics and Space Administration

Award amount

$124,976

Program and phase

SBIR · Phase I

Award year

2018

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
FREEDOM PHOTONICS LLC
Proposal award date
2018-07-27
Contract end date
2019-02-15
UEI
FQ98KK1G9199
Solicitation number
SBIR_18_P1
Topic code
S1

Research abstract

Silicon photomultipliers (SiPMs) are on the verge of revolutionizing all low light sensing and photon counting applications. The combination of low cost, compact size, and miniscule power consumption offers an attractive replacement for expensive, bulky, and power-hungry photomultiplier tubes (PMTs). SiPM laboratory setups typically include a bench full of heavy test equipment. The associated cost, size, weight, and power (c-SWaP) of this additional equipment present many practical challenges to the deployment of SiPMs, particularly in airborne and space missions.Many applications benefit from a large tiled array of SiPMs. However, a large SiPM array presents a challenge in proper signal conditioning and handling large volumes of data. The key to solving this challenge is a complete read-out integrated circuit (ROIC) that takes the quantized analog signal from the SiPM array and converts it into useful digital data for the user. This ROIC not only manages the SiPM array data but does so in a manner that significantly reduces the associated c-SWaP from a benchtop solution, a key requirement for practical SiPM deployment.The ultimate goal of this proposal is a fully integrated ROICthat interfaces to a SiPM array and is readily adaptable to both airborne and space deployed systems. The objective of Phase I is to develop the requisite components of a ROIC for photon counting and to assemble these components into a single channel of the ROIC. A test chip will be developed in Phase I to mitigate the risk of subsequent phases. This test chip will contain the relevant ROIC components, as well as a single channel of the ROIC, and will be designed, laid out, fabricated, and characterized in the Phase I effort.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

196 SBIR/STTR records share this UEI (2005–2023). Reported award amounts total $74,583,672. Reported amounts are not federal obligations.

Phases: Phase I, Phase II, Phase II – Direct to Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Environmental Protection Agency, Department of Agriculture

Agency intelligence

National Aeronautics and Space Administration

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