SBIR/STTR Research Award

Boron Nitride Nanotube Novel Thermal Management Materials Technologies for High Power Naval Systems

Award identifier 9c310b6d8a58fa77f0f8215acadf77342f38fd7841a209fe886256a1ad833fa1Awarding agency Department of Defense · Navy

Award amount

$124,853

Program and phase

SBIR · Phase I

Award year

2018

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
BNNT LLC
Proposal award date
2018-06-11
Contract end date
2019-08-23
UEI
YG25NMGFRND9
Solicitation number
18.1
Topic code
N181-078

Research abstract

Increased performance requirements of high-power or high-frequency electronics require novel thermal management materials. Boron nitride nanotubes (BNNTs) enhance performance of polymer-based electrically-insulating thermal interface materials (TIMs). This work will incorporate BNNTs into common micro-particle polymer composites to increase thermal transport between particles. Thermal impedance within TIMs is dominated by resistivity of the polymer which holds the thermally-conductive particles together in the matrix. Typically, inter-particulate space is 20% of interfaces’ volume. A multi-scale, bottoms-up approach to fabricating the filler material is expected to increase the thermal conductivity of many TIMs to above 10 W/m·K. TIMs based on epoxy, cyanoacrylate, silicone, silicone oil, nylon multipolymer thermoplastic, and polytetrafluoroethylene matrices will be explored. Preliminary in-house work already dramatically increased thermal conductivity to nearly 6 W/m·K in thermoplastics doped with BNNTs, implying an increase in inter-particle conductivity of ~20X. The TIMs produced in this study will be characterized for in- and through-plane thermal conductivity, and filler material development will be aided by scanning electron microscope imaging and surface area analysis of the densified powders to determine optimal ratios of components. The TIMs fabricated will be applicable within components, and as adhesives, pastes, top-side coatings, substrates, underfills, gap fillers, gap pads, and laminates.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

9 SBIR/STTR records share this UEI (2018–2025). Reported award amounts total $8,244,634. Reported amounts are not federal obligations.

Phases: Phase II, Phase I

Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration

Agency intelligence

Department of Defense

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