Dynamically softening implantable microelectrode arrays

Project summary We propose to demonstrate the feasibility of softening multi shank microelectrode arrays which are stiff during insertion and soft during chronic useTo dateno one has demonstrated aD softening electrode arrayCurrent technologiesmade from silicon can be miniaturehigh densitybatch fabricated and capable of supporting active on board electronicsSiliconhoweveris a brittle materialand while its stiffness allows for easy implant into soft neural tissueit presents a serious mechanical mismatch between the implanted device and the soft neural tissue after implantOther current penetrating flexible electronics technologies have been limited toD structuresIn this Phase I SBIR proposalQualia Incwill explore the feasibility of adapting its planar processing thin film photolithography technologies into a third dimensionPrevious SBIR funding from DARPA helped establish our shape memory polymerSMPsubstrates as candidates for chronically viable neural implantsHoweverour past studies have been limited toD devicesIn this proposalwhich is focused on innovative packaging technologieswe aim to createD architectures which fill a critical void in the neuroscience research community Project Narrative A central goal of contemporary neuroscience is to understand the relationships between the functional connectivity map of neuronal circuits and their physiological or pathological functionsCurrent multi shank microelectrode arraysthe tools used to assess these phenomenaare not chronically stable limiting their clinical efficacyQualia Incproposes a softeningD multi shank electrode technology that could extend the lifetime and increase the performance of implantable bioelectronics