High Performance Computing for Rapid Design and Optimization of Roll-to-Roll Etch Processes
Award amount
$224,704Program and phase
SBIR · Phase IAward year
2018Award details
- Awarding agency
- Department of Energy
- Branch
- Not reported
- Recipient company
- SANDBOX SEMICONDUCTOR INCORPORATED
- Proposal award date
- 2018-04-09
- Contract end date
- 2019-04-08
- UEI
- RF6NNDAKBPS4
- Solicitation number
- DE-FOA-0001770
- Topic code
- 03a
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Advanced Manufacturing and Material Measurements Software Tool WEAVE for the Accelerating and Automation of SEM image analysis in the Semiconductor Industry
- SBIR Phase II: Disruptive Semiconductor Software Tool for Recipe Optimization for Deposition and Etching Processes
- Advanced Manufacturing and Material Measurements Software Tool Weave ™ for the Acceleration and Automation of SEM Image Analysis in the Semiconductor Industry
- SBIR Phase I: Disruptive Semiconductor Software Tool for Recipe Optimization for Deposition and Etching Processes
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Realtime Neuromorphic Cyber-Agents (Cyber-NeuroRT)
- Turnkey Meshing for HPC Design and Optimization Platform for Microelectronic Components
- Extending Remote Gas Sensing Range
- High Speed and Low-Noise Open-Path Gas Detection System
- LPT DE-FOA-0002360 3a, Extending Remote Gas Sensing Range
Research funding history
5 SBIR/STTR records share this UEI (2018–2020). Reported award amounts total $2,401,971. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: National Science Foundation, Department of Commerce, Department of Energy