Radiation Mitigating System-in-Package Electronics

Trusted Semiconductor Solutions will demonstrate how high-reliability substrate material, leading-edge commercial memories, advanced manufacturing processing, and our radiation circumvention and recovery approach enables high density electronic payloads needed for next generation guided missile and space applications. We will develop a prototype system-in-package (SiP) that utilizes commercial memories, a radiation detector, circumvention, and recovery circuitry, failover logic, and a microprocessor, and integrates them into a compact, rugged device. Our radiation hardened, scalable, high density payload electronics can be integrated into missiles and satellites for improved computing and data storage performance at lower size, weight, and power (SWaP).Approved for Public Release | 17-MDA-9395(24 Oct 17)