Manufacturing Process Development for High Temperature Polymer or Nanocomposite Films for Dielectric Capacitors

In this SBIR project, Polymics proposes to develop high temperature high energy density film capacitors using Polymics proprietary class of advanced high temperature polymers and their nanocomposites with dielectric constant (K) higher than 3, thermal stability above 200 C, and dielectric loss less than 1%, to meet the targets of a 95% or higher charge/discharge efficiency to 400 volts/micron at 125 oC and energy storage capability better than biaxially oriented polypropylene (BOPP) (at room temperature). The program will integrate the extensive experience and resources at Polymics in manufacturing and commercialization capabilities of high temperature polymers and nanocomposites with the expertise at Penn State in developing high energy density high performance polymer film dielectrics.