Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

This proposed Phase II sequential effort will build upon the Phase I and original Phase II programs by: 1) Supporting AFRL's ongoing flight experiment of Oscillating Heat Pipe (OHP) chip carriers to evaluate their compatibility with and performance in a space environment; 2) Expanding the OHP operating limits and steady-state performance models to further improve the predictability (and perceived reliability) of the nascent OHP technology for real-world aerospace applications with micro-chip heat fluxes from 300W/cm;3) Improving the Manufacturing Readiness Level (MRL) of ThermAvants OHP production and testing processes to ensure OHP thermal solutions meet the high-reliability and maintenance-free operation for lifetimes exceeding ten years as required by AF112-057; 4) Providing a clear technology transition path for the prototype OHP chip coolers developed herein by partnering with system integrators and payload providers seeking heat spreaders with low thermal resistance, tailorable coefficients of thermal expansion, and other features needed to meet space qualification specifications; and 5) Fulfill contract deliverable requirements (e.g., host/attend meetings; generate on-time technical reports and annual summaries; and deliver hardware, manuals and other written materials per CDRLs).