Bonded Joint Analysis Method

During Phase I and Phase II, M4 Engineering, Inc. and Sandia National Laboratories have created a unique bonded joint analysis methodology and associated software. During Phase II.5, the developed techniques will be further enhanced and a fully functional commercial analysis code (SIMULIA/Abaqus) plug-in will be created. The software plug-in will make the advanced technology accessible to all levels of practicing engineers via integrated pre- and post-processing modules. The technology is based upon a world class nonlinear constitutive equation for polymers developed over a decade at Sandia. A two-pronged approach consisting of concise surrogate models (i.e., traction-separation interface models) for design and analysis and high fidelity models that can be used along with experimental data for surrogate model parameterization will provide the Navy a comprehensive bond modeling method. During Phase I and Phase II, ductile and brittle adhesives for metal bonding have been studied. The upcoming Phase II.5 work will include looking at an additional adhesive, as well as composite substrates. Hence, a key part of this work will also include an experimental program to populate the high fidelity models and validate the surrogate traction-separation models.