SBIR/STTR Research Award

200Gb/s WDM Optical Transceiver Chip Modules with RF Transmission, Quadrature Modulation and Fail-Safe Capabilities

Award identifier cb43c3a04a650c43b85b1b867719b094c563021e59c348589288059b62256542Awarding agency National Aeronautics and Space Administration

Award amount

$122,136

Program and phase

SBIR · Phase I

Award year

2016

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
Optonet, Inc
Proposal award date
2016-06-10
Contract end date
2016-12-09
UEI
VA46QQN3DRB7
Solicitation number
Not reported
Topic code
H9.01

Research abstract

There have been significant interests from NASA in integrated optical transceiver chips for space optical communications, in particular space-qualifiable 1550nm laser transmitter and receiver with optoelectronic laser, modulator, and detector, that are capable of data rates from 1Gb/sec to 200Gb/sec. The power efficiency shall be better than 10W per Gb/sec and weight less than 100g per Gb/sec. In addition, hybrid RF-optical technologies are sought, and technology based on integrated photonic circuit solution is strongly desired.Operational range of -20? C to +50? C unpowered temperature cycling from -40? C to +40? C are also desired.To address the above mentioned interests, our proposed works will focus on realizing 100-200Gb/sec high-data-rate Wavelength-Division-Multiplexed (WDM) photonic transceiver module with the capability to transmit RF signals on optical beam as well that will be able to meet the above NASA requirements, based on a few key technologies we have developed including: (a) WDM Laser Transmitter with Concurrent Wavelength Locking Capability;(b) Ultra-Compact Wavelength Mux/DeMux; (c) Integrated Narrow Linewidth Laser;(d) Integrated 20-40Gb/sec High-Speed Electro-Optic Modulator with Low-Voltage Capability; (e) Polarization-Insensitive Multi-Mode-Fiber-Capable Integrated 100-200Gb/sec WDM Optical Receiver with Fail-Safe Wavelength and Power Recovery Capabilities; (f) Ruggedized Wide-Temperature-Range Chip Packaging Module.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

20 SBIR/STTR records share this UEI (2004–2018). Reported award amounts total $5,113,247. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Science Foundation, Department of Energy, National Aeronautics and Space Administration

Agency intelligence

National Aeronautics and Space Administration

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