Microfabricated High Thermal Conductivity Heat Spreading for Space Based Applications

ABSTRACT:We propose to create a low-profile vapor chamber using the ChipChill microfabrication process to remove heat from GaN power amplifiers that dissipate 600W. This heat spreader is required for space applications where thermal densities greater than 62W/cm2 cannot be removed using traditional spacecraft thermal engineering solutions. This microfabrication process is capable of creating copper structures that encourage delivery of the fluid to and from the hot spots. Corrosion resistant coatings are employed to ensure maximum lifetime of the devices.BENEFIT:This thermal solution for GaN power amplifiers distributes heat from localized hot spots to larger surfaces. This allows traditional thermal management solutions for space systems to be employed. This technology has great benefits for future solid-state power amplifiers. In addition to space hardware, military hardware for terrestrial, sea-based, or airborne platforms have similar requirements for improvement. Each commercial mobile device has a custom heat spreader that could be more effectively designed and fabricated with the freedom provided using the ChipChill microfabrication process.