SBIR/STTR Research Award

Ultrasonic Additive Manufacturing for Capillary Heat Transfer Devices and Integrated Heat Exchangers

Award identifier 06f3315741a829f1e36766f697e4313e4146096f387fa21a1dc52e582963c685Awarding agency National Aeronautics and Space Administration

Award amount

$124,999

Program and phase

SBIR · Phase I

Award year

2015

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
SHERIDAN SOLUTIONS LLC
Proposal award date
2015-06-17
Contract end date
2015-12-17
UEI
LSKHKJW7Q9G3
Solicitation number
Not reported
Topic code
S3.07

Research abstract

The goal of this program is to demonstrate the use of Ultrasonic Additive Manufacturing (UAM) to 3D print aluminum structural panels with integrated thermal management passages. This includes pumped integrated heat exchangers for fluid loops, integrated heat pipes, and integrated wick systems. By combining two functions (structure/thermal) it will be shown that a lighter weight, higher performance solution can be built in a shorter time period. The project team will demonstrate technical feasibility in Phase I. In Phase II the team will use UAM to 3D print an aluminum structure capable of carrying structural loads with integrated thermal management passages as may be used in a pumped integrated heat exchanger. This demonstration unit will be delivered to NASA for testing at the completion of the Phase II contract.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

6 SBIR/STTR records share this UEI (2015–2016). Reported award amounts total $2,624,648. Reported amounts are not federal obligations.

Phases: Phase II, Phase I

Agencies: National Aeronautics and Space Administration

Agency intelligence

National Aeronautics and Space Administration

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