Copper Wire Bonding Assurance for Microcircuits in Military Applications

In Phase II of this study, MicroNet Solutions, Inc (MSI) will perform extended reliability testing on different types of commercially available molding compounds and package styles available in the market to determine if the molding compound composition significantly changes the environmental testing from both a thermo-mechanical and corrosion point of view.The goal will be to provide a matrix of electro-optical terahertz pulse reflectometry (EOTPR) test data that can be linked to specific physical characteristic of the quality of the copper wire bond such as thickness of the aluminum metal under the copper ball bond.The test data will be matched up against the detailed failure mechanisms uncovered during the extended environmental testing.Approved for Public Release 15-MDA-8169 (20 March 15)