Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and Design

Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geometries, and board materials. This system will be validated against other more complex modeling tools for its accuracy in determining fatigue life and also in selecting design options. Space Micro has had many products transition out of SBIR and STTR awards and we expect to transition this technology. Approved for Public Release 15-MDA-8161 (11 March 15)