Templated Micro-Channel Thermal Control System

Electronic systems have increasingly high thermal demands that need improved cooling solutions that are reliable, light weight, and low cost. From computer data storage centers and electric vehicles to on-detector electronics used in nuclear physics instruments, a liquid-cooled micro-channel thermal control system will help improve the performance and reliability of these electronic systems. A new manufacturing method has been developed to produce 3-dimensional micro-channel thermal management systems. Continued optimization of the manufacturing process and micro-channel design will enable cost-effective, high performance solutions for mitigating heat removal in electronic devices. A Phase I program demonstrated a new manufacturing method to produce micro-channels with feature sizes in the 100 micron range at a fraction of the cost of traditional methods. The process was scaled to produce 2 x 4 liquid-cooled thermal management units where improved thermal performance was measured with regard to competitive air and liquid-cooled systems. The manufacturing process was also demonstrated to produce 3-dimensional designs with intricate fluid flow pathways and features opening up new micro-channel thermal management design possibilities. A Phase II program is focusing on optimizing the manufacturing process, scaling it upwards of producing 100,000 units per year, and optimizing the performance of liquid-cooled micro-channel designs. Internal and external test validation is being conducted with thermal management integrators to show the merits of these new micro-channel systems for cooling high heat flux electronics. New electronic system designs for computer data servers, hybrid electric vehicles, avionics, medical and office equipment, and telecommunications have heat removal requirements in the 100-1000 W/cm2 range as well as specifications for keeping device touch temperatures at less than 100 C. Accordingly, liquid-cooled micro-channel thermal management systems are some of the best low-cost solutions to remove this heat from these electronic components.