LOW THERMAL SENSITIVITY WDM RECEIVER

The interconnect networks of datacenters and extreme scale high performance computers (HPC) will require a bandwidth density, in terms of connections per area, that cannot practically be met with todays optical transceiver technology. The push for high-radix connectivity in combination with an ever increasing amount of data transported on these advanced networks requires increasing numbers of fiber connections which are projected to scale beyond what can be accommodated at the network switch front panel interface. To keep pace with big data and HPC, optical transceiver technologies must evolve from discrete component solutions with data channels transmitted over parallel fibers, to integrated photonic solutions which use wavelength division multiplexing (WDM) to transmit multiple, high data rate channels on a single fiber. In this way, cost-effective optical transceivers with unprecedented bandwidth densities can be realized to keep pace with the connectivity needs of datacenter and extreme scale HPC. In this program, Aurrion proposes to partner with IBM to develop low thermal-sensitivity, high bandwidth-density optical receivers which will enable the high speed (>100Gb/s) and high interconnectivity advanced network topologies that will be needed for datacenter and extreme scaling computing. Building on previous work where Aurrion and IBM demonstrated a single channel 60 Gb/s digital optical receiver, phase 1 will focus on developing an athermal WDM receiver design compatible its high speed photodiodes and IBM electronics. In subsequent phases, full receivers, incorporating the designed demultiplexors, photodiode arrays, and electronic drivers can be demonstrated. If successful, the technology developed in this program will be commercialized to address datacenter and HPC market needs.