Thermal Enhancements for Separable Thermal Mechanical Interfaces

ABSTRACT:The proposed SBIR Phase II program will develop a thermally enhanced, separable thermal mechanical interface (STMI) that significantly enhances heat transfer by providing a direct thermal path from the high power density components to the heat sink. In the current commercial off-the-shelf STMI multiple interfaces significantly increase the thermal resistance resulting in marginal heat transfer. The need for improved thermal performance is required as power densities of electronics increase. The Phase I program modeled and developed a functional prototype STMI demonstrating the feasibility and potential thermal performance improvements compared to current state-of-the-art solutions. The thermal performance of the STMI was enhanced by: (i) increasing the bulk thermal conductance of current state-of-the-art STMI, (ii) reducing the contact resistance by optimizing the clamp design, and (iii) integrating an innovative card lock mechanism to increase the contact area. A reduction in thermal resistance as compared to a COTS retainer of 57% was experimentally illustrated. In Phase II, ACT will further improve the design of the Phase I prototype to achieve an overall reduction in thermal resistance of 90% as compared to current retainer solutions. This will be accomplished through mechanical and thermal optimization of the STMI component and thorough testing of prototype devices. A design for manufacturability study will also be performed and a technology transition plan will be developed. BENEFIT:At the end of the Phase II program, ACT will have designed, fabricated, and demonstrated a STMI that is thermally and mechanically superior to the current state of the art. This thermally enhanced STMI will increase the conduction cooling capacity of current, as well as future, electronics systems used in the aerospace, defense, and commercial sectors. ACT has a strong grasp of the customer base due to the synergy between this technology and current product offerings. The proposed STMI solution is a direct replacement for current cardlock solutions and is well-suited for space and avionics systems as well as terrestrial applications. The ubiquitous usage of STMIs in military and commercial applications makes the proposed concept a widely versatile solution to a long-lasting problem in electronic system thermal management. ACT will protect any further developments or combinations by patents.