High-Performance, Low-Power, Acceleration-Compensated Oscillator Technology

The feasibility of three different approaches to achieving the desired capability shall be studied during Phase I. (1.) Utilization of silicon MEMS resonators, incorporated into a MEMS based oscillator along with MEMS based accelerometers for active vibration compensation shall be investigated (2.) Utilization of a temperature controlled quartz resonator, electrostatically levitated in order to reduce sensitivity to vibration as well as to provide thermal isolation (in order to drastically reduce the required power) shall be investigated. In this case, infra-red thermal control through a transparent window incorporated into the resonator enclosure shall also be studied, as a required element of this approach. (3.) Utilization of a temperature controlled quartz resonator, in which the resonator is mounted with extremely low thermal conductivity, but high electrical conductivity mounts.