SBIR/STTR Research Award
Novel Temperature and Vibration Tolerant Packaging for Inertial Sensors (MEMS)
Award amount
$1,499,892Program and phase
STTR · Phase IIAward year
2013Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- EPACK, INC.
- Proposal award date
- 2013-09-09
- Contract end date
- 2017-12-31
- UEI
- GXJGJPPV3LT3
- Solicitation number
- 2012.0
- Topic code
- N12A-T008
Research abstract
The objective of this proposal is to demonstrate a generic package that provides high vacuum, temperature control and vibration isolation for a wide range of high performance (tactical and navigation grade) micromachined inertial sensors. Inertial sensors (accelerometers and gyroscopes) are now widely used in consumer and industrial applications. However, for high performance navigation and targeting applications there are several packaging challenges which act as roadblocks to their commercialization including: i) their need for low vacuum pressures (<
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Ovenized Inertial Micro Electro Mechanical Systems
- High-Performance, Low-Power, Acceleration-Compensated Oscillator Technology
- High-Performance, Low-Power, Acceleration-Compensated Oscillator Technology
- Ovenized Inertial Micro Electro Mechanical Systems
- High-Performance, Low-Power, Acceleration-Compensated Oscillator Technology
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- High-Vacuum Package for MEMS Inertial Sensors
- Novel Temperature and Vibration Tolerant Packaging for Inertial Sensors (MEMS)
Research funding history
14 SBIR/STTR records share this UEI (2010–2016). Reported award amounts total $8,028,265. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Science Foundation, National Aeronautics and Space Administration