Heterogeneously Structured Conductive Resin Matrix/Graphite Fiber Composites for High Thermally Conductive Structural Applications

ABSTRACT: In Phase II, major focus will be directed to the performance optimization and scale-up fabrication demonstration of the heterogeneously structured carbon fiber reinforced polymers (CFRP) with high through-thickness thermal conductivity for thermal management applications. The major research and development activities are: 1. Surface treatment study of nano- and micro-scale conductive fillers to optimize interfacial bonding, thermal, and mechanical properties in the resultant composites. 2. Study and optimization of sintering parameters to enhance particle connectivity for enhancing through-thickness conductivity. 3. Fabrication study and development to improve and optimize the formation and quality of heterogeneously structured conductive paths of the multiscale conductive fillers. 4. Scale-up fabrication demonstration. 5. Development of preliminary design database. 6. Support of application demonstration study. Success of the proposed effort will lead to an affordable and scalable approach to make thermally conductive (>20 W/mK) structural graphite fiber composites for potential Air Force, DoD, and NASA applications. More importantly, these techniques and manufacturing processes are potentially easy to scale-up and low cost due to utilizing commercially available materials and conventional composite manufacturing processes. BENEFIT: These efforts will provide lightweight"thermal management"solutions that will have applications in composite airframe structural parts. Lack of adequate through-thickness conductivity of current CFRP structures has limited their use in thermal management applications, and requires the use of additional heat sink and dissipation devices that dramatically increase weight and cost considerations. Specifically, this newly developed technology will accelerate the insertion of nanotechnology and nanomaterials into current designs and composite structures using current material systems and manufacturing processes, with expected cost reductions and efficiencies. These activities will lead to unique improvements in"thermal management"capability for commercial aircraft by dissipating heat load during limited aircraft idling time; reducing heating of fuel by electronics by potentially eliminating metal heatsink devices; and simplifying structural design and reduce overall structure weight. Furthermore, effective heat dissipation of aircraft onboard electronics also will lead to high system reliability. Thermal management plays a very vital role in the packaging of high-performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged device. Market development of this commercial sector will be an additional focus in Phase II.