SBIR/STTR Research Award
Chip-Scale Photonics for Wide Temperature and High-Speed Optical Interconnects
Award amount
$99,888Program and phase
STTR · Phase IAward year
2013Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- ULTRA COMMUNICATIONS, INC.
- Proposal award date
- 2012-12-13
- Contract end date
- 2013-06-11
- UEI
- XJWHA6PGHM25
- Solicitation number
- 2012.A
- Topic code
- A12a-T008
Research abstract
This program will create 40 Gbps VCSEL-based micro-transceiver (uTRX) components that operate reliably over the standard military temperature range of -55°C to 125°C in Army environments. uTRXs are low-cost, compact components that can be assembled into the PCB in close proximity to high-performance ASICs using conventional solder-reflow"pick-and-place"assembly. The small PCB footprint and solderability is necessary to achieve high-density and flexible placement of optical components near the data source/sink. By reducing the routing lengths of high-speed copper wiring, we can achieve low-power, EMI-immune links within high-performance military computing and sensor systems.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Built-In Test Capable Aircraft Sensor and Stores Fiber Optic Interface - Star Coupled Net with BIT
- Multi-Wavelength and Built-in Test Capable Local Area Network Node Packaging
- Built in Test (BIT) Capability for Multi-Mode (MM) Fiber Data Networks
- High-Speed Data Transmission in Multimode Fiber
- Robust Optic Signal Distribution within Enclosures for Aerospace Applications
Research funding history
58 SBIR/STTR records share this UEI (2005–2017). Reported award amounts total $22,990,939. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy