Novel Monolithic Microwave Integrated Circuit (MMIC) High Flux Heat Exchanger

This successful Phase I effort demonstrated the feasibility of an innovative Heatsink solution to passively dissipate waste thermal loads for the Solid-State Active Denial Technology System (SSADT) eliminating the need for active liquid cooling in and around the Monolithic Microwave Integrated Circuits (MMICs). The Heatsink solution utilizes the embedment of high thermal conductivity Thermal Pyrolytic Graphite (TPG) within 6061T6 aluminum to create a high thermal conductivity path for waste heat to be driven to a heat rejection surface. TPG has a very high thermal conductivity 10 times that of aluminum 6061T6. However, TPG is not a structural material and cannot be machined into the necessary heatsink configuration for the SSADT program by itself. By embedding the TPG within aluminum a structural component can be made so that the heatsinks can be mechanically integrated into the overall assembly. Peregrine"s innovative composite approach utilizes the high thermal conductance of TPG with the structural capabilities of 6061T6 aluminum to provide an enabling solution for SSADT"s needs.