Manufacturing Process Optimization of Ultrasonic Bonding of Metallic Composites

This project will build on a substantial body of empirical research to develop and validate multiscale models of ultrasonic bonding during tape placement of metal matrix composite (MMC) structures. Experiments to-date have been guided by knowledge of the ultrasonic bonding of metals heuristically applied to the more complex problem of bonding MMCs. While all scales are of interest in a complete understanding of ultrasonic additive manufacturing (UAM) of MMCs, we will focus on the largest and most relevant scales initially. By using multiscale models that simulate how materials respond to processing conditions we can reduce the number of large-scale experiments while shortening the development cycle. Current issues in UAM of MMCs include first ply bond, surface morphology, thermal/ultrasonic process window, thermally induced stress, work hardening, void dynamics, reinforcement damage, and structural resonances. UAM is currently being used for rapid prototypes including tooling, embedded sensors, and other applications. UAM with MMCs is ideal for high performance applications such as reinforced gun & mortar tubes for sustained fire as well as other military, industrial, downhole, and aerospace structures where service temperatures exceed the capabilities of polymer matrix composites.