Multi-Chip Module Maturation, Whole Wafer testing, and Reworkable Epoxy Bonding

The Navy is looking for a novel way to"test the functionality automatically of all the die on a wafer before it is diced to find the working die and then to mount the"known-good"die into a larger circuit in such a way that repair to the functionality of the whole can be accomplished by replacing the part, not the whole."The enabling technology is a reworkable adhesive with a combination of properties; reworkability, cryogenic (4K) thermal conductivity, removability without residue, and full processing below 125C. This is desirable for testing complex but immature circuits as"known good die"prior to committing them to a permanent and expensive assembly step. The team of Space Micro Inc. and XXXXXXXXX has deep expertise in die attachment, high frequency testing and materials development will leverage that resident expertise and test capability to develop this technology.