Monolithic S-band Multichannel Transmit/Receive Module for Communication Phased Array Antennas

ABSTRACT: Phase I tasks will produce a full-duplex, multi-channel, S-band transmit-receive (T/R) module design and the associated panel structure for integration into large communication phased array antennas. An RF section featuring advanced, two-chip Monolithic Microwave Integrated Circuit (MMIC) technology will replace the large number of discrete RF components in existing systems and an integrated command microcontroller will provide internal protection and built-in test capability. Design of the module will include interconnection and distribution circuits as well as the mechanical and thermal configuration. The anticipated advantages of this approach are size, weight, and cost reductions and maximized manufacturability, reproducibility, flexibility, and ease of replacement. Initial small- and large-signal simulations using foundry design kit models with associated layouts have been incorporated into the receive (Rx) and transmit (Tx) MMIC simulations presented in the proposal to show the feasibility of this approach. In Phase I, the design will be completed including electromagnetic simulations to account for parasitic coupling and to optimize performance and circuit integration. The module capability will be verified in Phase II with prototype fabrication and demonstration in a scalable 4x4 sub-array of a module supporting full-duplex, multiple simultaneous communication links. BENEFIT: This technology is applicable to military and commercial communication and radar systems. Commercial application: High performance, affordable, satellite and mobile communications.