Supercontinuum Fiber Laser for Multi-Spectral Energy Propagation

ABSTRACT: Based on our success in developing the world first commercial high power femtosecond fiber laser system and our leading technology development in ultrashort pulsed fiber laser and nonlinear fiber optics, PolarOnyx proposes, for the first time, a compact all fiber based high power (>kW) mid-IR supercontinuum source (1-5 micron) to meet with the requirement of the AF solicitation AF09-BT01. The laser is a specialty fiber based MOPA incorporating our proprietary technology of pulse shaping, spectral shaping and polarization shaping in generation mid-IR pump source at band IV supercontinuum generation. A tabletop experiment has been demonstrated in Phase I time frame for proof of the concept. Over 1kW MIR output power will be demonstrated in Phase II. BENEFIT: The proposed high power fs fiber laser and mid-IR source can be used in many applications, such as spectroscopy, metrology, sensing, and space, aircraft, and satellite applications of LADAR systems and communications, laser weapons, and target designation and illumination. With successful development of the laser, the technology proposed by PolarOnyx will provide a vital tool to solve the existing and potential issues and merge with the huge markets including Spectroscopy and chemical sensors for environmental pollution monitoring as well as process control and breath analysis for health monitoring and disease diagnostics, since practically all molecules posses characteristic vibrational bands in the mid-IR. Medical equipment and biomedical instrumentation. The high power amplifier/laser can be applied to ophthalmology, refractive surgery, photocoagulation, general surgery, therapeutic, imaging, and cosmetic applications. Biomedical instruments include those involved in cells or proteins, cytometry, and DNA sequencing; laser Raman spectroscopy, spectrofluorimetry, and ablation; and laser based microscopes. Material processing. This includes (1) all types of metal processing such as welding, cutting, annealing, and drilling; (2)semiconductor and microelectronics manufacturing such as lithography, inspection, control, defect analysis and repair, and via drilling; (3) marking of all materials including plastic, metals, and silicon; (4) other materials processing such as rapid prototyping, desk top manufacturing, micromachining, photofinishing, embossed holograms, and grating manufacturing.