Innovative Sensor Packaging and Testing

Infrared optical systems are advancing rapidly. Infrared Focal Plane Arrays (FPAs) have grown from small single color scanning detectors to large two-color detector arrays. New materials and processes are improving IR system performance. But the transition from promising laboratory-based technology to fielded system is slow, due in large part to the low Technology Readiness Level (TRL) of the technologies. Often the transition is further hampered by a lack of standardized testbeds that could provide a way to quickly evaluate new technologies and move them into the field. To address this need, AOS proposes to establish a testbed using an existing modular design for an infrared dewar system as the core IR sensor hardware test platform, an FPGA-based sensor processor, and a computer-based test control console. AOS"s Modular Integrated Dewar Assembly (MIDA) has been manufactured as part of a previous SBIR project and the system is available to serve as the universal test set that will allow devices under test to be incorporated rapidly. Key to this testbed is our development of modular interfaces that use kinematic self-alignment techniques to provide repeatable zero-alignment interfaces. By implementing interfaces that comply with deterministic and repeatable component alignment standards, the MIDA allows parts to be easily interchanged with no significant redesign cost. Figure 1 shows the concept.